The Mechanism And Improvement Study Of Full Package Isolation Fail

Semiconductor is a greatest invention of 21 th entury,Semiconductor industry continuously developing from 1980 TO & DIP series to SMD packages and other packages which with high integration level & stronger function,stronger function,higher integration,more efficient.Full package is wide using now due to low cost,such like TF220 and Mitsubishi and Fairchild's IPM products.Due to more and more products still using the full package process,more and more guys looking at the Isolation fail.In this material,base on actual practice of TF220,we collected abnormal materials and separated as different failure modes,after that,we did analysis on possible root causes and issue mechanism.Then,we did FA analysis,mapping analysis and mold flow simulation to find the issue locations.Then,we did parameter verification and EMC comparison and design review to verify the potential root cause.Finally,after parameters optimization and proper part life control,etc.We get 75% of issues improved and lesson learn for future better design.