Application Research For Semiconductor Test Manufacruring Line Capacity Planning

Semiconductor devices is an important component of electronic products, withthe increasing popularity and rapid development of electronic products, thesemiconductor manufacturing capacity planning problem has become an importantresearch topic of the semiconductor manufacturing field. The semiconductor capacityplanning problem is more flexible and dynamical, due to the semiconductor productshave some characteristic such as the complexity of the process, technologydeveloping with high speed, the short life time of the product and the smart responseto customer’s requirement. On the other hand, the equipment and factory facility isvery expensive for semiconductor industrial, the delivery cycle time of the equipmentis very long. In today’s market environment of low-profit, rapid responses of thesemiconductor manufacturing company have become an important means to serve themarket.This paper summarized the general methods and research status of semiconductormanufacturing capacity planning, analysed the characteristics and problems of thesemiconductor assembly and test capacity planning. The subject of this paper is aboutcapacity planning in DRAM Packaging&Test plants. This research establishedmathematical model for capacity design of packaging line with linear programtechnology, aiming as maximizing the profit of the line in Hytech(Wuxi)Corporation(for short as HT). It also uses YALMIP, MATLAB and CPLEX tooptimize such mathematical model. Through production practice in HT line, themathematical model shows its ability to solve problems in expanding packaging&test production capacity. This article provides with a scientific planning tool of thecapacity planning in semiconductor packaging&test plants, and the tool with niceapplication value.