Research On Reliability Test For Homemade Plastic Semiconductor Devices

Nowadays, plastic package devices have been widely used in civilian field, andsome of them have been also used in field of high reliability. Because the material forsemiconductor dies of plastic package device is very cheap and devices with thispackage can be produced automatically in large numbers, more and more transistors andintegrated circuits adopt plastic package in recent years. therefore, plastic packagedevice will be applied in aero and military field with development and applicationneeds.Plastic package devices were paid more attention to in field of high reliability,however because the requirements for these field is higher than that for civilian field,and systematic research on plastic package device is few at home, thereby it lacksbasis for users to choose these products and exists high risk, especially when they areselected in fields of high reliability. So, users have to considerate every factor when theyselect plastic package devices.Reliability of all products need to be considerated in the process of design,fabricate and use, to avoid faults, so that to extend their life of use. It is more importantwhen they are used in field of high reliability.In this paper, following contents were analyzed and researched, that users mayknow reliability of plastic package devices further, especially select them in fields ofhigh reliability. They are:1. Reasons for plastic package devices will be applied more in aero and militaryfield with development and application needs.2. Application and development of plastic package devices at home and abroad.3. Analysis of general failure mode of plastic package devices and methods toimprove reliabilities of plastic package devices.4. Reliability level and main failure mode of homemade plastic package devices bya lot of tests data; To determine screen, qualification, and acceptance test itemsconditions and criteria; To provide test basis for reliability research and technique route.It summarized achievements and speed of progress of the research on a series ofreliability of plastic package devices at present stage, and provided a thought on design,manufacture, inspection, test, measurement and storage.