Notebook' Heat Sink Fin Shape On The Influence Of Thermal

At present the thickness of the notebook is more thinner,its performance is more higher.The fin shape of the radiator is the main factor that it limit the thickness and performance of the laptop.The current radiator fin shape is not optimal.When the air flows through the fins,due to there is the impedance of the fin to the air,the flow of air in the fins will decrease.At this time,the heat dissipation area of fins and air heat transfer coefficient aren't in the optimal equilibrium state,and the heat dissipation performance of the radiator is not optimal.This paper will study the relative balance of the heat dissipation area and heat transfer coefficient.It include the fins space,the height of fins,the bending of fins and the perforation of fins.First study heat dissipation of the related literature at home and abroad.Understand the current research situation of notebook radiator related fields and the advantages and disadvantages.Second cooling simulation theory and actual unifies,choose the current mainstream commercial software Flotherm.Last establish the reasonable boundary conditions of notebook thermal simulation model.The relative balance of heat dissipation area and heat transfer coefficient was solved by using the method of physical sample experiment and comparison analysis of software simulation data.Due to the coupling of heat transfer coefficient and air flow velocity.It is necessary to study the two parameters of fin heat dissipation area and air flow.This paper show the air flow is constant,the heat dissipation performance is reflected by the specific fin size.According to the results of the study.Finally aiming at certain Samsung laptop get the fin gap 1.2 mm;height of 7.4 mm;bending of 0.2 mm;hole 2 mm*2mm radiator optimal performance.The minimum chip temperature.At the same time reduce the radiator thickness from 7.8 mm to 7.4 mm,drop by 5.12%.Due to the heat dissipation performance is improved,Samsung NP500R5H-X09NP500R5H-X07 notebook,the radiator fin structure has been adopted in this thesis writing,the Samsung company applied for a patent for utility model,water cooling unit and the cooling unit of notebook.