Study On Heat Dissipation Of High Power LED Chip Package

In recent years,the global energy-saving emission reduction advocacy and national policies related to support,LED lighting has been rapid development.Compared with the traditional light source has a long life,small size,energy saving,high efficiency,fast response,seismic,pollution,etc.,is considered to enter the field of ordinary lighting "green light source",LED large-scale general lighting An inevitable trend.In this paper,based on the realistic social demand,based on the relevant theory of heat dissipation,based on the relevant literature,"chip packaging production process","high-power package" as a guide,high-power LED chip cooling technology status and The existing problems are expounded and analyzed.The problem of heat dissipation of high power LED chip is studied and the solution is put forward.The current situation and development direction of LED market,as well as the current popular packaging technology,on how to improve the optical properties of LED,life,from the chip structure,chip materials,packaging technology analysis,using finite element method,theoretically The feasibility of the solution,and put forward several solutions to high-power LED chip cooling solutions.Experiments show that the cooling scheme is effective and feasible.