Design And Optimization Of Power And Heat Dissipation In Embedded Computer System

High integration of modern electronic devices led to high power produced by them. At the same time, heat dissipation goes with power is the main factor which constrained the development of the electronic equipment; its higher working temperature could make the electronic system instable, even not working.Due to the significance of the research on power design and heat optimization in electronic equipment, the problem on origin of the heat dissipation is discussed firstly in the paper on the basis of the studies and progress home and abroad. Summarization about power design and heat dissipation is proposed subsequently from two views of power and heat analysis and heat control. On one hand, current low power design and its hierarchy are studied deeply. And main design methods or power models of each hierarchy are also presented in this paper. On the other hand, heat control, heat exchanging styles and laws are studied, and each heat dissipation law is inferred. Some numerical calculation methods are deduced and studied at the same time. Design flowing graphes of electronic equipment are presented. A platform of multiplex temperature measurement based on DAQ PCI 9112 is constructed. By virtue of the platform, certain computer box is established using the finite difference method. From the perspective of heat dissipation, experimentation and simulation of the computer box working condition are done. Simultaneity numerical validation test is executed by thermal analysis software Flotherm. After thermo-electronic analogy is discussed, current heat dissipation components are simulated and tested with the multiplex temperature measurement platform, and working states of the natural cooling and forced cooling are compared and studied together. Later thermal resistances of heat conduction and convection are calculated in the test. The end of the paper, a methodology of thermal resistances network optimization based on thermo-electronic analogy is presented. And it is realized to optimize thermal resistances and power using genetic algorithm.