Research On High-reliability Heat Dissipation Installation Technology Of High-power Devices

For high-power devices operating in a vacuum,the heat generated during operation is mainly dissipated by heat conduction.From the perspective of the installation process,the most direct way to reduce the thermal resistance on the heat dissipation path during operation of the high-power device is to increase the contact heat transfer coefficient at the installation interface.This paper takes the high-power device of TO-254 package as the research object.The steady heat flow method was used to analyze the specific influence of the installation pressure and the type of thermal interface materials on the contact heat transfer coefficient between the device mounting surface and the heat sink.The ANSYS finite element analysis software was used to establish the high power device junction temperature calculation model under different heat dissipation installation processes,and testing the thermal resistance of the test samples by the thermal resistance test equipment,comparing with the simulation results,and finally,the ideally quantified heat-dissipating installation process condition of high-power devices is obtained :0.7~1.1Mpa,and the thermal grease and the thermal insulation pad are mixed and used as the thermal interface material.By determining the quantified heat-dissipation installation process conditions of highpower devices,the probability of shortening the service life of the aerospace electronic singlemachine product in the orbital service process due to the high temperature of the high-power device is shortened,and the data is significant for the making standards of the heat-dissipation installation of the power devices.