Design And Implementation Of HD STB SoC Package Based On SiP Technology

High definition television raises the demands of high-performance, low-cost and time to market for Set-Top Box (STB). Based on the study of the existing STB chip package solutions, this thesis proposes a package solution based on System in Package (SiP) technology. The main work of this thesis is as follow:First, this thesis introduces the developing status of SiP technology as well as the mainstream chip technology of domestic and foreign STB chips. It analyzes the classification and process of the package, Re-Distribution Layer (RDL) technology and memory technology.Second, this thesis introduces the design requirements of the package solution and analyzes the design specifications of design for manufacturing (DFM), the package thermal performance and the package reliability. And on this basis it propose the architecture design of the package solution, including the selection of package, the selection of Dynamic Random Access Memory (DRAM), the design of RDL and the interconnection design of the package. This thesis completes the selection of package, the selection of DRAM, the design of RDL, the design of bonding netlist, the selection of leadframe, the design of DRAM and main die location and the interconnection design of the package, which contain the interconnection between DRAM and Exposed Pad (EPAD) and the inner lead, the interconnection between the main die and EPAD and the inner lead, the interconnection between the main die as well as the interconnection between DRAM and the main die.Last, this thesis completes the test and simulation of DFM, the package thermal performance and the package reliability based on the design requirements. The result shows that the SiP package solution that this thesis proposes can fully meet the design requirements.The SiP package solution that this thesis proposes significantly improves the capacity and performance of the embedded DRAM memory, which provides a high-performance and low-cost package solution for STB chips. The SiP package solution not only is applicable for STB chips, but also for other applications that need a large-capacity and high-speed embedded DRAM memory.