Study On The Sealed Electronic Equipments Structural And Thermal Design

Along with the rapid development of modern electronic science, the problem of the electronic equipment about the small volume, compact structure and specific requirements is posed on. On the other hand, the function and complexity of electronic equipment is increasing day by day. Making electronic devices within a limited range of volume, power density increasing, a rapid increase in the heat flux density, results in a sharp rise in the temperature of the electronic equipment. As result the failure rate is becoming more and more frequent. Therefore, in order to guarantee the electronic equipment in the corresponding environment, the design of heat is one of the key points and it must be considered. At present, on the heat problem of electronic equipment, small size, complex function, power density high equipment and components were investigated by thermal analysis at home and abroad.In this paper we are taking a military closed electronic equipment radiator thermal design for example. Using of Icepak module at Ansys software is modeled and solved that respectively in harsh environmental conditions of temperature. By using the analysis method of the orthogonal test equipment heat in the primary and secondary factors determines the best design for the structural size of the radiator fin,and the temperature of the engineering prototype through the actual test verifies that the thermal design is correct.