Sealed Electronic Equipment Structure Thermal Design Research

With the rapid development of electronic technology, high-power,high-power-density devices are widely in the development and application ofelectronic equipment, however, how these high-power devices reasonably effectivecooling, in order to improve its reliability, but it is a difficult problem. In this case, thethermal design quality directly determines the success or failure of the product.Therefore, the thermal design and thermal analysis of electronic equipment, has longattracted the attention of domestic and international research department.This thesis is calculated through a sealed electronic equipment used in harshenvironmental conditions, elaborating the CAD model and the thermal design of someof the design ideas. Professional thermal design software for thermal analysissimulation, and temperature detection principle prototype to verify the accuracy of thesimulation, and simulation to optimize the structural design of the product. Andthrough an electronic device sealed chassis design examples to illustrate this.