Copper Interconnect Cleaning And Chemical Processing Equipment Software Control System

With the development of large scale integrated circuit industry, the nation invests “big fund”to the integrated circuit. So far, it has been established more than 12-inch semiconductor IC production lines in our country. Due to the process indicator of the wafer surface cleanliness is extremely demanded.Each step process is required to clean process of front end of line(FEOL) and back end of line(BEOL) at 12 inch integrated circuit production line. Semiconductor cleaning equipment in the production line has extremely urgent requirement. 12 inch integrated circuit automatic production line has almost no equipment from China. Semiconductor clean equipment software system has been researched and Developed “Great scale integrated circuit manufacturing equipment and complete sets of technology” in national science and technology major project of ministry of science and technology of China.We investigate software architecture and focus of research on the semiconductor equipment software in the world. We report the present status of software in domestic and foreign semiconductor equipment. According to the actual software requirements of single wafer clean equipment at SMIC(Semiconductor Manufactory International Corporation) in Beijing, We develop and design this software system. It fills the software gaps of this field in China. It has run successful at automatics production line in SMIC FAB.In this paper, discuss and research on software requirement, architecture and design of software control system for copper interconnect cleaning and chemical processing equipment. Firstly, the object oriented method is applied to function of software at this equipment. It is divided into five subsystems, which are cluster management control, transport control, process control, chemical delivery control, and factory automation. It is analyzed the requirement of each subsystem, so that each subsystem is meet the SEMI(Semiconductor Equipment and Materials international) standard. Secondly, this paper adopts layer structure to design the architecture for this software. It is divided into four layers, such as the presentation layer, the functional layer, the physical layer and the control layer from top to down. Each layer design is carried out with the design pattern method. It is designed the performance and reliability of this software, used fault tolerance technology in software system, esured reliability and stability of this software. After the software designe is completed, the service function, interface function and main function module are realized by using Remoting.NET technology, reflection technology and XML configuration file. Using custom communication protocol to realize the communication between hardware and software, and to debug and optimize the code. Finally through the NUnit unit test, integration test and system test, complete the software process from requirement analysis, design, and development, debugging and testing of the software development cycle.This software now is achieved the Demo certification in production line at SMIC FAB, is meet the requirement of factory automation.