| Wafer surface inspection stage, characterized with high-speed and high-precision, is an electromechanical integration device with extreme technical difficulties in development which places great demand to the dynamic characteristics of the stage. The motion stage is made up of many parts that are interconnected with each other in complexity. Since the improvement of the overall performance is greatly affected by dynamic characteristics, it'll be a challenging as well as significant work to establish an overall dynamic model.The appropriate preload value is obtained by stiffness analysis of guide-way column with bolt preload. The analysis of air bearing is under the condition of pressure, and the result of deformation is obtained by one-way fluid-solid coupling analysis. The stage is simplified with three sub-structure, connected by connecting unit. Dynamic parameters of rolling guide way are calculated with theoretical formula, and dynamic parameters of air bearing are identified by fluid finite element analysis. Dynamic simulation model of wafer inspection stage is established in ADAMS, which is validated with finite element mode analysis comparison and impact testing. So as to set up the co-simulation stage between MATLAB and ADAMS, the electricity, position, velocity PID control is designed. On the basis of built combined simulation model, the axial run-out error of wafer chuck and R axis follow error are simulated. The simulation result conforms to the requirement of the project.On the basis of theoretical calculation and finite element analysis, the multi-body dynamic model of wafer inspection stage is established, and is validated with experiment test. Through dynamic simulation analysis, the characteristics of wafer inspection stage are obtained. The co-simulation model was set up and the corresponding simulation was completed. All the results can support the optimization to improve wafer inspection stage, so the research on it is of high important. |
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