Design And Analysis Of Vacuum Chuck System In Wafer Inspection Stage

The production efficiency and quality of integrated circuit is ensured by the silicon wafer surface particle pollution measurement and detection equipment. With increasing radius of the silicon wafer, it tends to get a large deformation and easy to breakage by its stiffness characteristics get worse. Based on the State's major scientific research projects, the design and analysis of the vacuum system for wafer inspection stage aims at improving the efficiency of wafer pickup and ensuring stability of rapid adsorption process of silicon wafer.According to the needs of wafer inspection, the z axis lifting mechanism is used to drive vacuum cups and absorb the silicon wafer. The design and analysis of lifting mechanism, vacuum cups and other key components is processed. Adsorption process of silicon wafers is studied on the basis of this action, Establishment of adsorption process of silicon wafer dynamic model and analysis of dynamic characteristics of adsorption process of silicon wafer has been done by the principles of fluid-solid coupling theory and dynamic grid. By simulation results of the vacuum cup fast approaches the silicon, the wafer blowing has been influenced by the repulsive force that is generated by compressing gas during and causes instability during the adsorption process.Wafer inspection stage is an important equipment in IC manufacturing industry. The main responsibility of the stage is to picks up the wafer and move to the inspection position. The process of picking wafer is affected by a variety of factors, and it is a big challenge to reduce wafer deformation and ensure the stability during the pickup. Based on the State's major scientific research projects, this thesis studies the vacuum pickup system of the wafer inspection platform and the process of wafer pickup on the designing, analyzing and experimental researching.Finally, the experimental platform for wafer dynamic pickup performance has been discussed. It shows that the dynamic mesh modeling method is effectively reflect the dynamic changes of wafer pickup process and the result is consistent with the phenomenon of experiment before vacuum cups contact with the wafer. The wafer blowing with a high pickup speed could be restrained by the adjustment of vacuum with the influence of the vacuum and the pickup speed, which increases the stability of wafer pickup.