Research And Development Of Automatic Chip Mounter

The speaker manufacturing needs to Magnetic material construction engineering, M+C engineering, vibration engineering, combination and packaging engineering project. Patch is one of the important vibration engineering process. Because of differences in technical proficiency of artificial, artificial patch causes low productivity, high production costs and product quality issues such as uneven currently. To solve this problem, automatic chip mounter was developed. It has played a positive role in the speaker’s production efficiency and improving product quality. It has great prospects.In this paper, the overall structure of automatic chip mounter is designed and researched.Automatic chip mounter includes vibratory feeding equipment, feeding platform, the base,frame set,gas claw,etc. Automatic feeding device with vibrating feeding is able to identify the positive and negative chips. Stepper motor controls the speed and direction of transmission belt above the frame set. The two sides of the mold locates in the frame set, the position of the molds can be adjusted. According to the principle of vacuum adsorption, gas claw transfers the chips from feeding platform to the frame set of the speaker. Pneumatic control circuit and stepper motor control system based on PLC is designed to control pneumatic components and stepper motor.The control system is stable and reliable, and using the touch screen to control the operation is more intuitive to understand.Time-pressure dispensing technology uses in dispensing systems. To study the dispensing process, the knowledge of fluid mechanics is mastered.In this article, the characteristics and application of glue is described, and epoxy is elaborated. The basic theory of glue adhesion is summed up, viscous fluid properties is analyzed. Through the analysis found that the diameter of the dispensing hose and the length of such factors have an impact on dispensing volume.