New Generation Smartphone Chip Product Planning&Design Cost Analysis

The SOC(System on Chip) which included both LTE (Long Term Evolution) baseband and application processor in one chip is the core component of mobile terminals and the chanllenge of IC design,while it’s also the highlight of this thesis.The smartphone towards to multi-function, higher performance, multi-mode communications standards, platform consistency, and product homogeneity. And this corresponds with the trend of light and thin, large-screen, the development of low-cost trend, leading to conflict between power and performance has become increasingly prominent, product homogeneity resulting product life cycles are getting shorter. To solve this problem, how well in advance of product planning and the chip design cost forecasting and analysis is particularly important. Through the analysis of this thesis, the SOC process node should select28nm, package should select Flip-chip BGA, and baseband should support five mode of GSM/TDSCDMA/LTE-TDD/LTE-FDD/WCDMA.While, in this thesis, the author also include one WCN chip design case, while it could get more clear how to support product plan in real chip design project.This thesis is mainly the use of information collected, summarized, statistics and modeling assumptions and other methods. I find a lot of technical information abroad, market analysis and industry reports, summarized the new generation of smart phone chips are involved in key technologies, communications standards, and cost analysis, product planning and thus raise the chip clear ideas and goals. Through this research project, we can draw a new generation of smart phone chip product planning ideas and conclusions provide a target for the chip design guidance. Through the chip design cost analysis, to give quantifiable cost breakdown and computational tools for the rapid assessment provides a basis for cost.