A Study On The Quality System Of Wire Bond In Assembly

Wire bonding process is a very important and challenging step forsemiconductor assembly and packaging, almost for all of the packagetypes. In recent years, the development and production of semiconductorchip technology is developing very quickly, that means the technology ofwire bond should have a comprehensive improvement and upgrading inorder to adapt to the new requirements, wire bond process improvementand improvement will include the corresponding wire bond of key rawmaterials, optimization of process parameters and total quality control.This paper, I am taking the Six Sigma management methods as a guide,new products through the typical DMAIC method using Six Sigma tostudy advanced, and uses the DMAIC method to solve the product yieldand quality problems appeared in the production: first bond non stick.Through the research and analysis to every problemcomprehensively and systematically, find out the input factor has keyinfluence on the output variables, and these key factors were improvedand controlled, so that the production process for maximum optimization,the quality and yield of the product has a comprehensive upgrade.This process involves brainstorming,3X5, why analysis, DOE test,data collection, and data analysis and parameter optimization, continue todo the experiment. Obtaine the final parameters and put the products intothe production.When the product into a mass production process, it will be managedby a strong quality management system. It is called the statistical processcontrol (SPC), SPC is the basic methods of quality control, it is the basicmeans to implement a comprehensive quality management, plays a veryimportant role in the enterprise quality assurance, especially in massproduction, more dash forward show science and efficiency of SPC theory and tools.So airm at the needs of the assembly, combining with the reports ofsix sigma technology, method, using six sigma management to control thequality of new products in volume production,can create greatereconomic benefits for enterprises, provided a successful case forimprovement of product quality and production efficiency.Finally achieved the following two objectives:Through the improvement of parameters to improve the yield of wirebond process;Through the SPC system to monitor the quality of the massproduction, improve the stability of the wire bond process.