The Method Study On Wire Bonding Process Continuous Improve With DMAIC

With the developent of Intergrate Circuit(IC) technology, the IC capacity is bigger and bigger, company with the performance improving and resourse saving, it become the more and more serious challenge to IC assembly, for example, there are whole lot and more than 1000 units/lot scrap in production. It is a difficulty to the continuous improvement on each process. DMAIC (Define–Measurement–Analysis - Improvement-Control) is a good method to each process continuous improvement.this paper which is an IC assembly continuous improvement sample will study on how to use DMAIC and team work to decrease catastrophic scrap on Wire bond process.This paper is from what DMAIC is, after a project selected, team members can do their best to achieve the goal from the problems stating to the solution performing according to the five steps of DMAIC. Meanwhile, the IC assembly related knowledges and wire bond process procedure and the output control are all introduced. The details actions for catastrophic scrap elimination on wire bond process according to DMAIC are discussed from team build up, goal setting, project schedule, method discuss and perform to standardize FMEA, control plan, control system, program and procedure; optimize current management procedure and method; select the best system from the four factories for statistic process control and automation control; involve the best method, process, system, program and procedure into production.By this project, we achieve the project goal. With DMAIC using, we know it is a logic cycle on procedure, it emphasized on using quantitative analysis and statistic to describe products or procedures performances, management according to data for performance enhancing; it pursue to abandon the old habits, find the true and innovation solution for continuous improvement;...