Quality Control And Improvement Research For Wire-bond Process Of Semiconductor Manufacturing

As for B/E assembly of Semiconductor manufacturing, the wire-bond is the most important and challenging process. In recent years, the development and producing technology for Semiconductor chips have been progressed very rapidly and the wire count connected inside of the single chip have reached 600 wires or above. Therefore the single area of bond pad used to connect with the outer leads has decreased to less than 44um. With the change of all the key technical parameters, the wire-bond technology needs to have an overall improvement and promotion to meet the challenges. The improvement and promotion for the wire-bond technology include the betterment for the key raw material, optimization of the processing parameters and TQC (total quality control).In the paper, we apply the 6σmethodology to discipline our research. Freescale Semiconductor (China) Ltd applies 6σmethodology-DMAIC to lead the research, especially for the most challenging NPI--Low-k series products. The below three key issues which had influenced assembly yield and production promotion in mass production have been resolved:1. Low tightness or non-stick on the second bond placement.2. Non-stick on the first bond placement.3. Capillary jam.Continuously scheduled experiments have been carried out to do overall systematical research and analysis to find out each key input factors and define them. After the improvement and controlling to these positive factors, we have sought out the most optimized parameters setting and have an overall promotion of the production quality and assy yield. The 6σmethodology-DMAIC has created great economical benefit to our corporation and meanwhile it has also given an outstanding successful case to the quality improvement and production yield related to the relative production.