Lifted Bond Issue Study During Wire Bonding Process

Copper wire bonding technology is not the most classical and mature technique inexisting discrete semiconductor assembly process, but which also takes more and moremarket share in discrete semiconductor assembly process. Now copper wire bondingtechnology is being developed, bonding speed up fastly, smaller and smaller packagerequire that wire pitch and length reduce; ball size is smaller and smaller. Under aboveitens, one big issue was exposed, that is the copper ball lifted and, that issue impacts thereliability of semiconductor component directly.This thesis to analyse and study the defect of the lifted ball bond by actualengineering experiments in different aspects which are wire material, free air ballforming, ball bonding, capillary track, capillary life span, lead frame deformation,machine vibration, ultrasonic power, ultrasonic characteristic, temperaturecharacteristic. Base on above lots of experiment data analysis to find out the factors ofthe lifted ball bond in volume production.The lots of engineering data, analysis result provide the base to deeply undertstandthe quality impacts of ball bonding, and provide many data for future studing, in themean time, it also can guiding process establish for ball bonding.