The Study On The Quality Improvement Of Wire Bond Station For RF Ceramic Package

Semiconductor ceramic package is a special packing mode which can be applied under high power working condition directly. The final products yield rate is too low and can not reach RF performance and reliabilities satisfactory target due to the packing process complicate. For improve yield rate and RF reliabilities I chose the subject as researching.In researching, the paper combines six sigma statistical and management into the processing. Implement the following DMAIC 5 steps: Define: To confirm the wire bonding yield status and RF performance and select them as subject; Measure: Check out measure placement's original condition and find improvement basic theory; Analyze: Through source of variations--SOV method to analyze key points which affect yield; Improve: Implement process and equipments improvement; through design of experiments method--DOE, statistical process control--SPC and comparative method to stabilize process and improve wire bonding process yield; and in equipment improvement step, set it as trigger point of components which influence loop height and loop peak location, this made all equipments work on same base; Control: Revise related documents and regulations to keep gained improvements.Finally realized following 2 goals: Stabilization wire bonding process and improve the yield after change the new wedge; Improve wire bonder performance,step by step eliminate difference between equipments; and improve consistency of wire group. Through above two steps, improve RF performance and reliability of RF devices ultimately. And improve its RF performance and stability including gain,efficiency and IMOD.