The Advantage And Process Optimization For Copper Wire Bond

Regarding the chip, it is not only necessary but also a must. It can also be said that the seal refers to the other casing which the installed semiconductor integrated circuit uses. It not only improves the protection of the chip and enhanced heat transmission performance but also links the chips interior and exterior electric bridge circuit standard functions. The lead wire bond that holds the pivotal status in the semiconductor seal fills an important and complex assembly operation.Chapter I introduces the role and characteristics of the semiconductor package; Chapter II outlines semiconductor manufacturing process; Chapter III describes the position and characteristics of wire bonding process; Chapter IV expounds the advantage of the replacement of the golden wire by copper wire, include the low cost, resistance and IMC growth,enhanced mechanical properties, better thermal properties; Chapter V summaries the challenge of copper wire-easy oxidation, hardness, easy to have crack in dielectric and so on; Chapter VI puts forward the process optimization in the practical application, such as equipment for anti—oxidization, the parameter optimization for copper wire capillary, press and ultrasonic, bond pad composition and thickness, machine temperature control and so on. Chapter VII studies the common problems which would be encountered in production and propose the related solutions; Chapter VIII analyzes the reliability test for copper wire bond. At last, to research the develop direction for copper wire bond.