| The smart card has a thirty years history. It has been widely used in our daily life, from SIM cards, bank cards to traffic cards, even our ID cards and social security cards are embedded with smart card modules now. It’s reported in2011that900million SIM cards were sold in China, along with96million social security cards and14million bank cards. In2014the ID cards will bring another market growth in China because the first2nd-generation ID cards will be expired. The boom market forced the module providers into a fierce price war. And the module price dropped significant.In2005, Infineon developed FCOS (Flip Chip on Substrate) technology, which brought a revolution to the chip card assemblies. FCOS uses new material and flip chip technology, shorten the contact distance between chip and module, minimize the module size, and increase the mechanical reliabilities with high dynamic bending stress. Although FCOS takes the technology advantages, no cost advantages comparing to wire bonding modules almost killed its business.As a supplier of FCOS tapes, we’re always required by our customer price down. Unfortunately we didn’t find an effective cost down proposal until our competitor started to sell thin gold tapes and won more market share due to low cost and selling price. It forced us to develop our owner thin gold plating process for FCOS tapes.This paper is about the introduction of thin gold project in this supplier. It divides the project into four stages, uses WBS, CPM, RAM and risk analysis methodologies in every stage to plan, execute and monitor the project. The project stared in Dec2011and completed in Mar2012. It brought thin gold process from idea to production.The project reduced$0.3cents selling price. Our customer will save$0.72million by a monthly order20million modules. Meantime, the cost advantage brings us more FCOS tapes orders. Up to date, we’re receiving monthly purchase of28million tapes, which was only15million last year. The revenue increased significantly. |
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