Preparation And Optical Attenuation Performance Of Ni/SiO₂Optical Attenuation Slice

Optical fiber communication is a kind of weak power drive behavior, weusually adopt optical attenuator to control and balance optical power in order tomake the optical power within the scope of the need. The purpose of this articleis to prepare Ni/SiO₂optical attenuation slice by magnetron sputtering method,using metallic nickel have good optical absorption performance for thecommunication wavelength band to achieve the attenuation of optical energy.Ni/SiO₂optical attenuation slices were prepared in different sputtering powerof （300W,400W,600W,1000W,2000W）, sputtering pressure （0.2Pa,0.4Pa,0.6Pa,0.8Pa,1.0Pa）, sputtering time （5min,10min,15min,20min） withHDJ-800magnetron sputtering machine. Organization structure and opticalperformance of optical attenuation slice were characterized with XRD, AFM,SEM, Stereo Microscope and722spectrophotometer. In order to clarify theinfluence of technological parameters on film composition, we carried out theresearch on surface morphology, crystal structure, roughness and optical, etc.Experimental results showed that Ni film prepared by magnetron sputtering wascontinuous and dense and the distribution of nano-sized grain showed a gooduniformity. Ni/SiO₂composite film has been formed instead of physicalabsorption between Ni film and SiO₂glass substrate.Optical attenuation analysis showed that the attenuation ratio tend to bedifferent with different process parameters, Which mainly caused by thethickness of the Ni coating, impurities and internal defects. When the sputteringpressure took the value0.4Pa, the attenuation ratio can get a maximum value0.49. When the sputtering power took the value600W, the attenuation ratio canget a maximum value0.49. The attenuation ratio increased over time and got amaximum value0.56with sputtering time20min. Conclusion: Ni/SiO₂optical attenuation slice with better organization structure and better optical attenuationproperties can achieved when sputtering power was400W, sputtering pressurewas0.4Pa and sputtering time was20min, in this process parameters, theattenuation ratio of Ni/SiO₂optical attenuation slice was0.56. In the last part,numerical simulation was performed to analysis the magnetron sputtering processusing SRIM. Energy loss and ranges of incident particles with different energyare analyzed, and the location distribution of Ar+after impinging under differentconditions had also been researched.