Study On The Wirebonding Loop Formation Law And Experiment Platform Motion Control

In recent years, as the rapid growth of IC manufacturing, the IC packaging technology suffers huge challenge. The wirebonding is becoming high-density, high-speed and high reliability, these need the wirebonding equipment rapid growth.In this paper, study on the wirebonding loop formation. The relationship between bond head trajectory and loop profile has been analysed. The result shows that the bond head motion accuracy is an important factor to the loop profile. In order the experiment platform can use in the wirebonding process, the motion control of the experiment platform has been studied.The primary work in this thesis is as follows.1. On the K&S8028wirebonding equipment, the wirebonding test has been done. The image sequence of wirebonding process has obtained from high-speed video camera. The capillary motion parameters and loop profile were obtained from the image sequence.2. Based on the linkage-spring model, a prediction model has been established. This paper simulated the loop profile through linkage-spring model, and validated it by experiments. After that, the Taguchi method has been developed to characterize the various looping parameters.3. To the motion accuracy requirements of bond head moiton, a high-precision motion control has been done. The result of motion test shows that this platform can used for wirebonding equipment.4. In order to meet the requirement of bond head motion, a kind of motion planning has been used in the motion platform. The result of motion planning test shows that the motion error has become smaller than before motion planning.