An Exact Match Of The Etching Reaction Chamber

Pattern transformed by etching in semiconductor production. It requires higher reliability of the etch tool because of the chip shrinkage. Below 90nm node, Cu interconnect become the standard process instead of Al. But Cu easily diffusion in oxidation, so prevent pollution and keep etch rate stability is important. This context discusses Liner Remove process which will touch Cu, and the etch chamber matching is the solution which can meet this kind stability requirement:When release new product or new tool, the chamber must math the golden chamber. And all subsystem need be checked, and be calibrated in SPEC that can match golden chamber. And thus can ensure product’s matching.And no mater the product was manufactured early or lately, the critical dimension should be same, and the tool status should be no change. Use dry clean method solved NU% trend up issue. And use DOE find out stable process tuning window, and further test, find out recipe that can reduce NU%. Keep chamber in same status after maintenance or preventive wet clean. And only no hardware problem, then can adjust process parameter when happen product issue.