0.18 Nor Flash STI HDP Tiny Ball Process Improve Study

In semiconductor making wet clean process,HF is used in wet Clean process,mainly removed sio2 and clean surface parictcle on the wafer.in fact production process,we find some abnormal problem.this paper mainly analysis the defect in the fact engineering production.the factors are etch rate and wet clean ,at the same time, and supply the control solution to solve the defect,to get the stable clean result and quality。This paper for 0.18Nor Flash pre procuct process.We find tiny ball defect in STI Oxide Pre Clean process,we do some experiment to identify ,and use some advance machine and tool,wet bench,semision ,and so on.find the root cause ,and avoid of the defect menthod ,get good solution.to improve the current process flow。...