Based On The 32 Nm Lithography Dual Graphics Technology Research And Practice

In the recent ten years, semiconductor as a high technology has developed gradually, device fuctions become stronger and stronger. Meanwhile, its manufacturing is more and more difficult.In order to overcome the bottle neck of the manufacture, Design For Manufacture (DFM) has played an important role. As the most important part of DFM, Resolution Enhancement Technology (RET) and Optical Proximity Correction (OPC) have become more popular. As the 32nm technology node is coming, Double Patterning Tech, High Index Immersion Tech, and Extremely Ultra Violet Lithography (EUVL) are the main options for technology beyond 32nm. So far there is no conclusion about High Index Immersion lens set and liquid materials. EUV has also got into the dilemmar of the low illumination power, high reticle blanket defect ratio, novel resist, low throughput etc.. However, as one of the RETs, DPT it is believed to be the only access to 32nm even 22nm tech.The goal of double patterning is to improve resolution of dense circuit layouts by splitting them into two separate, sparser layers, imaging them separately, and recombining the images into the target pattern through the fabrication. DPT is considered as the main approach to get lower K1 factor and it has been included into ITRS in 2006. So far DPT is not mature to use in mass production, it is still at R&D, lots of problems are needed to be solved. Many companies have put more and more efforts for DPT since for most low technology node foundries it can use current tools to get smaller CD by DPT. It can also fill the gap between 45nm and 32nm, becoming the transition between immersion litho and EUV litho. Using DPT to enhance the litho tool resolution, it can lower the equipment investment.