Design And Implementation Of A Power Amplifier Agings Test System Loaded

With the development of electronic technology, a good electronic devices requirenot only high performance, but also high stability and reliability. RF power amplifier(PA) is an integral part of wireless communication devices, that is also need forreliability testing. High Temperature cycle impacting aging is an important way of thereliability testing and screening of power amplifier. The existing way of poweramplifier aging system have poor compatibility and can not fully restore the state ofreal work issues. Therefore,this paper designed and implemented a new poweramplifier aging system with multi band signal loaded.The power amplifier aging system can supply power voltage and single tone foramplifier of different type which frequency is between400MHz and2500MHz, andsample aging temperature, current, output power data and so on for testing. Agingsystem modulates and controls the aging status according to data analysis and show theresult to the screen.The power amplifier aging system is composed of four subsystem snoop software,BSP(Board Support Packet),the aging control board and CPLD logical code. Theaging control board is a hardware circuit board, and snoop software,BSP and CPLDlogical code runs on it to control the aging system. This paper describes thearchitecture of the aging system, detailed describes the specific design andimplementation of the aging control board and CPLD logical code module which aredesigned by author. The result of the simulation and test all show that this design.