Design And Implementation Of Wafer Bonder’s Control System

Bonding technology is becoming a primary technology in IC(intergrated circuit), and its applications in the microelectronics industry is also increasingly common. The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage. Different external conditions can be used for different materials and structural bonding. The control systems of wafer bonder has an important influence on bonding quality and success rate. Therefore, the research of the wafer bonder’s control system is very important.This subject designs a control program for wafer bonder in accordance with the requirements for bonding processes.The control system we designed include sequential control,process control,motion control,monitoring,and involves communication technology, human-machine interface(HMI) technology, computer technology, measurement and control technology. Wafer bonder is divided into five subsystems:aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding. Control section uses PC-BASED DA&C system to the wafer bonder’s coordination control.IPC can control some devices through the serial communication,and PCI-6229has the function of AI,AO,DI,DO. We have developed a user-friendly HMI by LabVIEW. The functions of software include bonding machine status and data display, user management, editing and execution of recipe, historical data storage.After the practice confirmation, the PC-BASED DA&C system can realize the coordination control of wafer bonder. Wafer bonding machine running stability, we have achieve the design requirements.