Developing And Studying On Automatic Die Bonder

According to the process of epoxyn dropping and chip placing in LED packaging , the dissertation intents to develop an automatic LED die bonder. The dissertation has studied and discussed the design of the mechanism and the virtual prototyping technology. They have the certain academic and practical value.This automatic LED die bonder made up of six mechanisms and two control modules. Six mechanisms are as follows: the epoxyn dropping mechanism, the die bonding mechanism, the chip feed table, the ejector, the LED frame transfer mechanism, the adjusting setting to fit the optic drawtube and lighting. Two control modules are the motion control module and the pattern recognition module. The main researches in this dissertation are as follows:(1)The die bonding mechanism designDesigned a serial mechanism including gemel rods mechanism, ball screw , stepper motor to complete the motion of bonding, picking chips by vacuum pressure and locating chips by air pressure, using Photoelectric sensor to detect no chip during bonding process. This mechanism fixed on a XY table that can conveniently specify the picking and bonding point. The mechanism has high accuracy, speed, universal characteristics.(2) Other mechanisms designDesigned a XY table including high-precision ball screw transmission, linear ball rail guide and stepper motor driving to feed the chips with high-accuracy and high-speed.Designed an ejector made up of an eccenter mechanism and V-shape guide to complete the short-distance motion of ejecting the chip accurately at high speed.Designed a mechanism to fit and adjust the CCD drawtube and lighting.(3) Key results of the bonding process are obtained by simulating the mechanical bonding motion with the dynamics analysis software ADAMS, in order to estimate whether to meet the design requirements.In this dissertation, the research include the systematic design and analysis of the automatic LED Die bonder, such as designing parts, mounting virtual prototype, simulation analysis, processing and assembling a physical prototype. several these machines are operating in the factory.The research in this dissertation Provides some valuable conclusions and simulation approach for the design and experiment of the LED die bonder. Besides, the idea and the methods used by the dissertation can use for reference to similar study, and laid a solid foundation for further research and development of more high-performance microelectronics packaging equipment.