Computation methodologies for efficient electromagnetic analysis of high-speed printed circuit board and IC package

As the system speed goes into the gigahertz range, the need to optimize the total solution including the chip, IC package and printed circuit board has never been more important to maximize the design performance and minimize cost.; This thesis presents an effort to formulate an efficient and accurate scheme of simulating the high-speed printed-circuit boards and IC packages. The field inside packages can be decomposed into parallel-plate mode and transmission line mode fields. The two dimensional finite difference time domain (FDTD) solver is used to model the parallel-plate field between package layers. A novel scheme is introduced to model the field penetration through metal planes. The frequency-dependent plane loss and medium loss are modeled efficiently in the transient solver through rational function models and recursive convolution. An improved numerical scheme for accurate and stable transient simulation of transmission lines with physically consistent frequency-dependent loss is presented to model transmission line mode field. The fields associated with two modes and the external circuits interact at the location of vias. The scheme of combining the fields and external circuits is proposed to solve one of the obstacles in the existing approach. Some important aspects of signal integrity issues are addressed. Decoupling capacitors are widely used to reduce the voltage fluctuations in a power ground distribution system. The effective decoupling radius of decoupling capacitors is investigated which provides useful insights of how to place the capacitor effectively.; The last chapter presents the transient simulation scheme of broadband multiport scattering parameter. A novel algorithm is proposed to enforce the bounded realness of the transfer function matrix through semidefinite programming. The computation complexity is significantly reduced by using trace parameterization.