The Research For Shinkwa SDW25Wire Bonders Wire Broken Problem

Full automatic wire bonder is one of the key equipment of microelectronicintegrated circuit manufacturing industry, with today’s technology and the rapiddevelopment of social economy, the full automatic wire bonder is faster and faster,accuracy is more and more high, the product quality and the production efficiency isalso greatly improved.The project originates from LeShan-Phoenix semiconductor Ltd., the majorobjective is to improve the problem that the machines wire break frequently of theSDW25type machines when wire bonding, and to improve an efficacy and to reducethe labour force intensity.First, we introduce the technology situation current, the developing trend, theworking principle, and the bonding process of the fully automatic wire bonder, andthen we adjusted the machines for standardization.Second, we analysis the force situation of the wire feed system and theelectromagnetic coil wire clamper of the fully automatic wire bonder. According to theresults it shows that the wire clamper is great effect for machines wire break.Third, be based on comparatively much piezoelectric material applying in recentyears, establish model between inputs and outputs of structure bimorphs of cantileverbeams, basing on model, confirm means of the piezoelectric ceramic wire clamper.And on the basis of the original electromagnetic coil wire clamper structure design ofthe piezoelectric ceramic wire clamper pliers body structure.Finally, According to need，we design driving power for piezoelectric ceramicwire clamper, and then test the clamper’s characteristic, experimental results show thatthe clamper can meet the technical requirements. On improvement of SDW25wirebonding machines in wire bonding process disconnection problems have a good effect.