The Research And Design Of Piezoelectric Wire Clamp For Wire Bonding Equipment

In the way of integrated circuit chip connect with the external lead, currently, the wire bonding is one of the most widely used technology. Automatic wire bonder is one of key equipment in the semiconductor package. Now in our life, whether common electronic products or manufacturing electronic devices, there are smaller volume trends, and therefore automatic wire bonder bonding must have a higher speed and precision requirements, it is a greater challenge. And the wire clamp is one of the key components of a wire bonding apparatus control leads transmitted. The rate of movement of the clamp and a reasonable size is one of the key factors of influence line arc consistency, and also directly affect the bonding quality and efficiency of semiconductor chips. From the analysis of different types of drive exists on the market today, selected the piezoelectric drive clamp. Now major domestic wire clamp is piezoelectric laminated type clamp, In contrast laminated wire clamp and the advantages and the disadvantages of piezoelectric wafer, has chosen piezoelectric wafer for research. The main research work is as follows:1) Analysis some of the basic characteristics of the piezoelectric ceramic materials as well as some important parameters, according to the working environment and requirements of wire clamp, choose appropriate piezoelectric actuator structure and adapted piezoelectric material. Depending on the selected bimorph actuator, select the appropriate mode of vibration, structural modes and ways to support the piezoelectric bimorph.2) Analyzed the theoretical of d-type piezoelectric bimorph, summarized some factors about driving the piezoelectric bimorph displacement, the driving force, stiffness and natural frequency. Mainly from the bimorph to length, thickness and width to consider, and respectively analyses the influence of a single factor to drive the displacement and the influence of natural frequency, and other important features.3) According to the basic requirements, designed the clamp actuator structure, and improved an electrical connection mode, and corresponding the clamp device is designed.In addition, from the driving power voltage amplifier, power amplifier, RC discharge circuit and an external circuit protection circuit started to design a piezoelectric bimorph type clamp driver board.4) Simulated analyze the actuator displacement and static performance by ANSYS, made of piezoelectric ceramic actuator driven plate, wire clamp, as well as the whole sample clamp device, and experimental research. The results of simulation and experiment test result can meet the basic requirements of the clamp, especially for the clamp required to drive the displacement. Driver board designed to drive the piezoelectric ceramics can achieve the use requirements.