Automotive Dies Packaging, Testing, Failure Analysis And Quality Management

Automotive help human extend the living area greatly, almost every corner of the world. Automotive also take the more and more important role in the human society, now automotive is not only the transportation tool but also influence our culture and living mode. With the development of the automotive industry, people want to get more function from automotive, which means safer, much convenience and better experience. All of the expectation will become true with the help of automotive electronics.The core of automotive electronics is IC (integrate circuits), IC help us make the automotive intelligentize become true. The study of automotive dies packaging, testing, and failure analysis and quality management is very important for the development of automotive electronics.This paper discuss automotive die packaging, testing technology in detail with rich of automotive electronics manufacturing, and also discussion the failure die analysis in detail.We can get such conclusion from the compare between general semiconductor manufacturing and automotive manufacturing, that is automotive semiconductor face big challenge from traditional automotive quality requirement, and also have the power to improve semiconductor manufacturing and innovation.