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Research And Optimization On Active Integrated Packaging Technology For Converter

Posted on:2012-11-17Degree:MasterType:Thesis
Country:ChinaCandidate:S S GuoFull Text:PDF
GTID:2218330362951575Subject:Electrical engineering
Abstract/Summary:PDF Full Text Request
The goal of this dissertation is to research active integrated packaging technology for converters, eliminating the wire bonding, making use of metal deposition interconnected to reduce parasitic inductance, reducing the switching losses and electrical stresses; At the same time, use the three-dimensional structure of double-sided cooling package to improve the module's thermal performance, thus reduce the volume of the active power. Therefore, the power electronics systems could achieve high power density and high efficiency, and it is another Power Electronics tremendous impetus, in addition to the device body outside.This paper studies the accurate mathematical model of switching losses and electrical stress, considering parasitic. Saber simulation model validating the mathematical model accurately. Based on the mathematical model derive with the quantitative relationship between the electrical stress, switching loss and the parasitic inductances. Common source inductance obtained mainly affects switching losses and electrical stress is affected by the drain inductance. So as to active packaging technology can improve electrical performance converter providing a theoretical basis.Second, research the existing embedded three-dimensional packaging technology of active integrated, exploring the original packaging technology in the industrial process problems and making improvements to achieve productive. At the same time, this packaging object has been demonstrated, and choice the power conversion unit as the package object, to minimize the parasitic inductance of the system and reduce the power circuit area being conducive to the system's EMC performance.Then this paper analyzes a variety of active integrated package module failure modes, and the focus of the module voltage and thermal cycling. Developed an active integrated package design, optimization methods and improve the reliability of the integrated module package.Finally, use the experiment verifying the correctness of the theory and process feasibility.
Keywords/Search Tags:active integrated package, mathematical modeling of switching losses and electrical stresses, parasitic inductance, Failure analysis
PDF Full Text Request
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