Electrical Characteristics Research Of Integrated Passive Devices In2.5D Package

With the rapid development of the semiconductor industry, the level of integration of multi-functional circuits and the need for the miniaturization of modules and devices increase rapidly. In the field of passive components, integrated passive devices (IPDs) has become a superior alternative to discrete passive components in order to achieve miniaturization. At the same time, along with the advancement of system-in-package and TSV (Through Silicon Via) technology, integrating the passive devices into2.5D package has become an effective solution for high-density electron devices. With the passive devices integrated, the interposer, in which are interconnection structures to the chip and substrate, can effectively achieve high-degree integration. This kind of integration can ensure signal and power integrity and reduce other interference at the same time.In this thesis, the electrical properties of capacitor, inductor on silicon substrate were simulated, three-dimensional full-wave electromagnetic field simulation tools were used to analyze and compare the effects of substrate loss and metal loss. After that the optimized structures of thin-film capacitor and inductor on silicon were proposed. Based on the study above, a passive band-pass filter on silicon substrate were designed and manufactured. According to the model of the physical structure and the equivalent circuit model composed of the filter, combined with the finite element analysis and numerical analysis methods, based on a three-dimensional full-wave electromagnetic field simulation software HFSS and circuit-level analysis software ADS, respectively, the electrical simulations of this filter were done. In this thesis, three kinds of simulation method were proposed:circuit-level simulation, three-dimensional full-wave electromagnetic field simulation and the combination of the methods above. Comprehensive comparison of the similarities and differences between these various simulation methods were done. Finally, according to the simulation results above, the optimized design of the filter was proposed. In addition, this thesis also proposed the application of the2.5D interposer in the integration of passive devices. The loss characteristics of this kind of2.5D integration were also evaluated. According to the results of simulation and optimization above, the fabrication and test of the filter were done. The test results showed that the performances of this device were in good agreement with the simulation results.