Integrated Circuit Failure Analysis Investigation

Integrated circuit failure analysis is extremely important for improving the reliability of integrated circuit. With the raise of integration and shrinking of process dimensions, the difficulties faced by failure analysis are also gradually increasing. Therefore, failure analysis must be equipped with the appropriate advanced and accurate equipment and technology, coupled with professional semiconductor knowledge to carry out analysis work.In this paper, chapter by chapter introduced the integrated circuit failure mechanisms, failure analysis process, discusses the various failure analysis technology and application in detail, supplemented by some typical cases to illustrate. According to the experience in practical work, the failure analysis can be divided into electrical analysis and physical analysis.For electrical analysis aspect, through Emission microscope and OBIRCH can help us to locate defect, professional circuit analysis and usage of microprobe are also important. Base on emission result, after IC schematic and layout overlay study, then microprobe is performed to trace the internal signal and find the abnormalⅠ-Ⅴcurve. OBIRCH can be used to find the defect location at last. Since the electrical analysis can only give the location of defects in the layout, so in order to know the specific circumstances of defect, we need to perform physical analysis which including deprocess, FIB, SEM, TEM, VC and EDS.Electrical analysis is the premise of physical analysis, and the result of physical analysis is the purpose and evidence for electrical analysis, every analysis step and technology is indispensable.