Computer Based On The Thermal Analysis Based On Thermal Design

Increasing scale of integration and consumption of power has led to the significant increase in power densities encountered in modern e— lctronic equipment. If we do not pay attention to the thermal management of electronic equipment, the large amount of heat generated by the el— ectronic device would not be under the control. Especially in some at —rocious surroundings, some devices' working temperature would exceed the rated temperature limit and lead to deteriorate the system stabil —ization or even make the hole system disabled .The research object of this thesis is a computer chassis that is located in a forced air field (forced convection) and from the essential equations of airflow we can deduce the mathematical model of the turbulent flow; based on the correct of the simulation by FE software , we can es— tablish the finite element algorithm and apply the FE software to work out the equations of turbulent flow. finally we can use the software to display and analyse the field of flow and temperature. After the simu —lation, we offer a new thermal management for Central Processing Units , the mothed is liquid cooling, then we can get the simulation to working temperature of the CPU and compared with air cooling, we analysis the applied outlook. Through applying the ANSYS software, this paper not only searches after the methods and traits of ANSYS when it is used in solve complicated electronic equipment design, but also offers useful reference to the reliability design of devices, and settles a base for realizing the CAM for the electronic equipment design.