Thermal Field Analysis And Optimization Design Of Distributed High Power LED Component

High power LED is used more and more because of its excellent performance in the field of lighting more. Especially in recent years, the semiconductor lighting industry is supported by the country, which makes the high power LED usher in a period of rapid development. At the same time, market and social demand for LED power increases with each passing day, but the heat problems have become more serious with the power increases. The performance and service life of the LED products is facing to a severe test. LED junction temperature measurement and electric characteristic detection become a urgent problem.This subject is to solve the problem of non-contact measurement of high power LED junction temperature. Finish the analysis and research on the electric characteristics of power LED lamps, and understand the internal structure and the heat dissipation way of high power LED lamps. According to the analysis and research of non-contact infrared temperature measurement technology, we have finish the analysis and research on many methods of measuring the junction temperature of high power LED, which has laid a theoretical foundation for building the subsequent junction temperature measurement model.In this paper, the current measurements can't directly measure the internal junction temperature of LED by packaging. So we propose a non-contact measurement model of LED junction temperature. The junction temperature model mainly includes two parts: the mathematical description of the relationship of between LED junction temperature and the temperature of the outer surface, and the correction algorithm of infrared temperature measurement. For the establishment of the former, we study the mathematical models of high power LED chips' thermal resistance, thermal radiation and temperature field. And then we give a finite element method of the LED lamp. At the same time, we finish the modeling and simulation for LED by ANSYS. And we give the mathematical description of the relationship of between LED junction temperature and the temperature of the outer surface.Secondly, we finish making experiments of collecting data by forward voltage method and infrared thermal imaging temperature. Through the analysis of a large amount of experimental data, we give a more accurate temperature measurement correction algorithm based on infrared thermal.Finally, combined with the both, and the application of 1W lamp and 100 W sunflower radiator LED verify the feasibility and reliability of the model. And we give the error analysis for measurement junction temperature model. The error rate is less than 3%.Compared to the peak wavelength method and the ratio method of blue and white, it has a stronger applicability and higher precision.