Optimal Control To Thermal Equivalent Device Of Integrated Power Electronic Module

With the continuous advancement of power electronics technology, the Integration of power electronic devices increase gradually, heat flux also increases steadily. Hot temperature environment will affect the performance of electronic devices. Nowadays, the study of effective heat dissipation for electronic devices has become one of the most important issues in the field of power electronics. Integrated power electronic module will generate a lot of heat after working a long time, and consume large amounts of electric power. Electronic components heat experiments are destructive experiments and the componentsare very easy to damage, to the study of heat sink, that increased the cost of experiments virtually.In view of this, we designed the heat facility equivalent integrated power electronic module by experiment. The heat productivity of heat facility can be controlled by integrating electrical control with mechanical control, We can obtain two Mathematical model respectively, on the basis of heating curve of the actual device, We put forward the control strategy, and set up a computerized monitoring system to detect and control the amount of thermal conduction of heat equivalent device, approximate the heat of actual power electronic integratedmodule. In this experiment, We can real-time shows the experimental process through the host configuration software.After the design, with other members’ results in this group, we set up micro-channel liquid-cooledsubstrate thermal testing system based on the heat equivalentdevice. In addition to simulate the results of the test heatequivalent device, we can test the cooling effect of the liquid-cooledsubstrate, ultimately envisaged the completion of this subject.