Wafer Probing Early Abnormal Findings Of The Analysis And Research

With IC testing plays a more and more important role in whole semiconductor industry, it has become a critical challenge for every testing house that how to solve abnormal case quickly and efficiently and decrease the overkill during production to ensure the yield is true as well as testing house can get an optimal OEE(Overall Equipment Effectiveness).This thesis studies the detection and solution of abnormal issue during wafer probing test, including overkill and hardware issue. This thesis also analyzes the principle, test method and the possible fail mode for most common test items in CP test. Base on the test concept and actual data, a suit of failure model and solution for those abnormal phenomenon are summed which can be used to cover most of faults during CP test.By studying the format and content of Standard Test Data Format, it's found that we can get the reason of overkill or failure through analyzing the recorded test data in STDF. According to this achievement, one software STDF Analysis Tool (SAT) was developed which is written by Visual Basic. By means of this tool, we can read STDF files and decode the parameter test record, function test record and tester warning messages to figure out the cause of overkill. Then the software can provide the clues for production line to solve those abnormal cases.In the last chapter of this thesis, some actual case are introduced, which use the SAT software to analyze and provide useful guide for solving CP test in production.