Wafer Probing Abnormal

IC testing can be sorted by Wafer probing and Finial testing, their main function is to inspect the defective IC, which is in wafer fabrication, and then find out the root cause among the defective IC. They can make sure the product yield is correct and provide the testing data for IC designing and manufacturing analyzing.Wafer probing can distinguish the good die and bad die by contacting the aluminum pad on the wafer for each die. For the memory products, Laser Repair can repair the repairable dice in addition. It can improve the yield for the wafer probing. However, how to reduce the testing time and overkill that is the bottleneck in wafer testing process.On the testing production line, the costly testers are the primary production equipments. The equipment depreciation is the major working cost. For instance, if the equipment is idled for one hour, it would cost company one hour depreciation loss. So, the utilization ratio of the equipment is the major concerning for the testing factory. That is means if you could keep the equipment production normally and continually, that is stand for the utilization of the equipment is very efficiency. Therefore, it is very important if you could analyze the problem efficiently; find the prevention and solution methods timely when any abnormal is occurred during the production.During the wafer testing process, due to the testing environment or prober parameter is changed that could cause probe mark shifting abnormally and even probe mark out of the aluminum pad. That will cause overkill and diminish the company's profit. So at here, I will share my knowledge and research results on probe mark abnormally during the wafer testing process.