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Development Of High Speed Ic Laser Marking Machine

Posted on:2011-12-24Degree:MasterType:Thesis
Country:ChinaCandidate:G T ShiFull Text:PDF
GTID:2178360308950130Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The IC laser marking machine is used to marking on the IC package's surface to show its information. This equipment includes IC strip transfer module, Localization module, Laser marking module and so on, and involves electricity, pneumatic, vision etc. Because more and more IC are used in every field, how to enhance produces are very important to every semiconductor factory. So it's very important to design the high speed IC laser marking machine. On the other hand the machine must be high precise to meet the requirement of the smaller chip's marking. So we developed this high speed IC laser marking machine.Firstly we introduced the machine's process of working, and then introduced the function and components of each module. We adopt computer-aided design method to modeling, FEA and optimization for the key module. On the next step, we analysis the machine's speed, and use dual carrier to improve the machine speed, and then analysis and optimize the moving parts to improve the speed. Finally we introduced the machine vision system, and designed the orientation checking system and locating system with machine vision.
Keywords/Search Tags:Laser Marking, Dual Carrier, Machine Vision, Precise Localization, Optimization Design, FEA
PDF Full Text Request
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