Design And Analysis Of Signal Integrity In High-Speed PCB

With the development of electronic system, the frequeney of clock and the density of PCB are incerasing rapidly. It is more difficult to transmit signal accurately in the interconnects.So how to guarantee the signal integrity of design is becoming one of the key factors for the PCB fabrication success rate.In high-speed PCB design, the signal integrity are affected by circuit interconnect which mainly is showed in the signal reflection and crosstalk two aspect. Base on the basic high-speed PCB signal integrity design flow and transmission line theory, this thesis analyzes deeply the cross-section steup and the impedance control which affect on the signal integrity, and also analyzes the method of model creation and validation witch is used in simulation before PCB placement. The Signal integrity analysis tools-Cadence is used in pre-placement and Post-Route to analyze the signal reflection and crosstalk in high-speed PCB base on the mechanism of signal reflection and crosstalk. So the appropriate solutions can be put forward, adjust and optimize the circuit, ensure signal integrity requirements, greatly increase the PCB fabrication success rate.The main contents in this thesis are as follows:theoretical analysis of high-speed PCB signal integrity design flow, transmission line theory,model creation and validation, signal reflection and crosstalk; putting forward the methods to reduce or eliminate the noises by the mean of simulation; Using EDA software and IBIS models,this paper designs the hardware of a Computer motherboard based on analysis of signal integrity.