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Thermal Analysis And Design Of PCB Electronic Circuit

Posted on:2011-06-01Degree:MasterType:Thesis
Country:ChinaCandidate:Y S HuangFull Text:PDF
GTID:2178360302491322Subject:Circuits and Systems
Abstract/Summary:PDF Full Text Request
A thermal analysis and optimization design of Printed circuit board (PCB) on signal pre-processing module is designed on the basis of the national project "PCB board-level thermal reliability analysis application platform".Beginning with the PCB's three thermal sources and thermal performance of the package structures, it is analyzed detailed that the structure of the PCB composition. On this basis, structures and components for the PCB layout is optimized to improve the thermal characteristics of components, heat dissipation capability and reliability of PCB. Firstly, the development overview of electronic equipment thermal design and thermal analysis technology is introduce,and a brief overview of commonly used electronic packaging thermal characteristics and PCB thermal design-related knowledge are shown in this paper. Secondly,it is introduced that the basic principles of heat transfer and the numerical solution of Compacted Model of PCB and effective thermal conductivity of PCB calculation.Then, the paper specific analysis the impact of the inner layer copper thickness on the PCB plane thermal conductivity and thermal via in the way of pattern, number and parameters on the PCB normal thermal dispersion ability,as well as boundary conditions and the component thermal models on the component junction temperature and the average PCB temperature.In addition,Thermal Force-Directed Placement Algorithm is used,detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown. Finally, the signal pre-processing module of a PCB thermal design of the program was optimized and carried out simulation.In this paper, the signal pre-processing module of a PCB thermal design of the program was carried out simulation with Flopcb software. The siulation results show that PCB cooling program has effectively improved the PCB cooling capacity, reduced component junction temperature and the average temperature of PCB, thus ensuring the required components of the ambient temperature within the safe and reliable work.
Keywords/Search Tags:Thermal analysis, Thermal design, Thermal model, Thermal resistance
PDF Full Text Request
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