Research And Development Of Multi-channel System-level Thermal Resistance Tester Based On Transient Temperature Rise Technology

With the rapid development of microelectronics technology,semiconductor devices towards high power,high frequency,high integration direction,increasing the power density makes the device temperature rise sharply,seriously affecting device performance and reliability.So the temperature rise and thermal resistance of semiconductor devices has become the focus of attention.At the same time,with semiconductor technology as the core of the various types of electronic components are increasingly widely used.The device density continues to increase and the size is shrinking,making the heat flux density increases,resulting in a sharp increase in the temperature rise of electronic components directly affect the device performance or even damage the device.Heat dissipation has become an urgent problem in the application of electronic components.An important indicator of heat dissipation is thermal resistance,and there is a thermal coupling between multiple heat sources.Therefore,the analysis of the system-level thermal resistance and thermal coupling effect on the heat dissipation path of the electronic components of the multi-heat source is of great significance to improve the stability and reliability of the product in the thermal reliability design.In this paper,with the semiconductor device as a simulated heat source,based on transient temperature rise technology,according to the actual project needs,developed a multi-channel system-level thermal resistance tester.The tester can not only measure the thermal resistance of multiple semiconductor devices at the same time,but also can analyze the system-level thermal resistance and thermal coupling effect on the heat dissipation path of the electronic components of the multi-heat source.The tester has the advantages of non-destructive,high precision and high practicability,which is of great significance for the design of thermal reliability of semiconductor devices and electronic system.In this paper,the following work is done in theory,experiment and engineering application:??The principle and method of thermal resistance measurement of semiconductor devices are studied in depth,and the design and development of multi-channel devices and system-level thermal resistance tester based on transient temperature rise technology of semiconductor devices are completed.It mainly includes the design of hardware circuit and the design of cabinet.Among them,the hardware circuit part mainly includes multiple test circuit,multi-channel switching circuit,multi-channel current control circuit,multi-channel acquisition circuit.And solve the problems encountered in circuit debugging.Design a multi-channel PCB implementation method.And solve the difficulty of PCB layout caused by the large scale of multi-channel tester circuit.Finally,to complete the instrument industrial design,including the design and assembly of the chassis and cabinet.??Aiming at the fixed problem of the device when the thermal resistance of the semiconductor device is measured,a device automatic fixed device based on closed-loop control is developed for the thermal resistance measurement of the semiconductor device.The device in the thermal resistance measurement process can automatically set the pressure value of the device,a high degree of automation,high precision,simplifying the thermal resistance measurement operation,improve the measurement accuracy.The multi-channel thermal resistance tester developed in this paper has been put into use in China Electronics Technology Group Corporation 14 th research Institute,and has been running steadily for more than a year.The thermal resistance tester can quickly and accurately measure the thermal resistance and thermal coupling effects of high power T/R components and their thermal system in phased array radar.The tester provides a key technical support for the thermal reliability design of the T/R components of our phased array radar.