The Simulation And Analysis Of Microelectronic Chip

Chips are prevalent in life and production and playing an important role in modern civilization. But with the reducing size and the increasing heat flux, chips in terms of the rising temperature will cause irreversible damage. Moreover, the entire electronic system will even collapse. Thermal problem is a key constraint to the development of microelectronic chip, so it is very important to simulate and analyze the thermal characters of chip.In this paper, the numerical analysis will be used. We will make a thermal simulation model and check the mold in order to ensure its accuracy and predictability. Seven factors including ambient temperature, the position of chip, the conductivity of packaging materials, the conductivity of PCB, the thickness of welding materials, the power of chip and cooling wind will be discussed. At last, we will compare these factors by orthogonal test and know the most important factor for junction temperature of chip is ambient temperature.The practical significance of this paper lies in the fact that we can utilize the curve of the chip junction temperature to provide a thermal design reference.