| Integrate circuit(IC) is the foundation of modern information industry and information society. IC industry has become the basic and strategic industry of national economy and national defence construction. At present,the IC design and manufacture level of our country has existed a large gap comparing to the advanced country of the world .Therefore,to exploit IC manufacturing equipment is of great significance to the development of the integrate circuit industry of our country.Wire bonding technology is commonly used in modern microelectronic packaging. With the increase of chip integration and size reduction, more and more fine pitch chip-based, precision micro-electronics packaging have become increasingly demanding. Wire bonding process involves precision machinery, automation, image recognition, optical, ultrasonic welding and other hot issues. This project comes from science and technology project supported by Guangzhou City in 2008. It belongs to the significant and advanced equipment and its key components in the Field of Optical-mechanical-electrical integration. This article is mainly on the researching and developing the Control-system of the automatic gold wire bonder.1. Analyze of three typical bonding methods: hot pressing bonding, ultrasonic bonding and ultrasonic hot bonding. Point out the working principle of wire bonding and several key parameters for good control. And motion control subsystem and imaging subsystem was introduced. By comparison, the Intel IPP library was final choiced for image processing.2. In order to achieve fast positioning the chip, projection of the image was used to determine the general location of target chips, and then the new image was processed Wavelet transform was used to weak noise from image acquisition and transmission, and multi-scale adaptive wavelet threshold algorithm for the different layers was designed.3. Changes in the environment or the image light source will have a greater impact on the image. This will make the value of matching template reduced. In the light intensity compensation algorithm for non-uniform illumination, representation methods are homomorphic filter based on frequency , top-hat transformation and two-cubic interpolation method. Taking into account the complexity of the algorithm, homomorphic filter based on the airspace change was selected to adjust the image brightness.4. Analyze of the overall structure of the system's software and propose the three-tier structure model of the software. In order to adapt the real time requirement of feeding and feed for the welding pressure welding machine, the system uses a multi-thread approach to design. To manage the versions of software development in a team, the version of development tools Subversion was used. It is a better solution to the software development process in many participants, many amendments. |