Research On Heating Process Optimization And Thermal Analysis Of PCB Components Dismantling

With the rapid development of science and technology, more and more electric and electronic equipments come into end-of-life stage. As the base of electronic industry, PCBs are important component in electric and electronic equipment. With the increasing number of electronic waste, the number of discarded PCBs also shows sharp upward trend. If disposed properly, it can save resources, protect environment and promote circle economy. However the kind and number of components mounted on PCBs are various, how to dismantle them effectively is always the difficult part of waste PCBs recycling.At present, disassembly of electronic components by heating waste PCBs is the common method, melting of soldering is the precondition in this method. Aiming at different types components, this paper takes components of computer board as research object, uses self-developed equipment to analyze their heating craft and process. By authority summation billiard-marker and a series of experiment, the heating craft is confirmed and the heating disassembly model is constructed. Aiming at SMD and THD, the heating process is arranged experiment by the way of response surface unitized design and uniform design separately. Two quadratic polynomial model are constructed, by which optimal parameters for disassembly of SMD and THD were found and their veracity is validated by a series of experiments.Finally, heating process in disassembly of electronic components is simulated by ANSYS software, the change of solder joint temperature with heating temperature and time is studied, which provides scientific basis for the heating process optimization in the course of disassembly.