Study Of PCB Board Level Circuit Modular In Paste Simulation System

In manufacturing process of electronic equipment, the kind of unit board level circuit modular is overall much,requirement of batch rapid changing, period short, cost low, quality good, size small, and upgrade rapid. We already extensive apply SMT surface pastes to pack production line. The combination of SMT and fictitious production is helpful for promotion PCB board level circuit modular to design level and correct to guide the processing of PCB board level circuit modular,and realizes fast manufacturing really , so it is research hot point.Aiming at the PCB designed by EDA(Electronic Design Automation) software, the thesis has researched and discussed the 3-Dimension visualization method of SMT in computer. The simulation of SMT machining process based on OpenGL was detail expatiated. Taking PROTEL as case, the thesis expatiates on the format of EDA software, and designs a data interface which can adapt different EDA software. Through analyzing the shape of electronic device, the thesis proposes a method of abstracting 3-Dimension objects to points and arcs. The greatness modeling workload problem had been solved due to various electronic devices. Through particular analysis of PCB object, the thesis brings forward the CSG modeling method, and adopts inlaid technology and display list technology. A practical simulation environment of manufacturability is established, and dynamic simulation of SMT implemented. So analysis result and errors prompt can be achieved.